Semiconductor fabrication can involve hundreds of steps and take months to complete. FOUPs must safely transport wafers while preventing defects and contamination. We offer compact, high-accuracy sensors that integrate easily into wafer carriers, enhancing reliability and performance. By monitoring temperature, humidity, and environmental conditions, our sensors help maintain process stability. Our sensors make semiconductor manufacturing safer, more efficient, and more precise.
Substrate storage and handing
FOUP: important tool for storing semiconductor chips and an integral part of the cleanroom environment
How our sensors make a difference
Precise environment control
FOUPs are purged and filled with nitrogen to provide a controlled environment in which wafers are stored. Other gases can also be injected for pre-treatment steps in finer structures (e.g GAA and 3 nm nodes).
Real-time monitoring
FOUPs continuously monitor parameters such as humidity, oxygen and AMCs (airborne molecular contaminants) to avoid particle deposition and oxidation on the surface of wafers.
Safe transport and handling through automation
Automation ensures that the wafers reach the individual cleanroom tools safely. At the same time, the risks of incorrect handling are minimized. This ultimately increases throughput by optimizing the manufacturing processes.
Why Sensirion should be part of your solution
Contact our sensor experts
Precision and cost saving
Our solutions control gas flow precisely inside FOUP chambers to protect delicate wafer structures. At the same time, we minimize excess nitrogen use during purge cycles, reducing waste and saving costs in semiconductor manufacturing.
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Our solutions control gas flow precisely inside FOUP chambers to protect delicate wafer structures. At the same time, we minimize excess nitrogen use during purge cycles, reducing waste and saving costs in semiconductor manufacturing.
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Integrating sensors in various spots of the FOUP chamber improves its performance and ensures homogeneous storage conditions.
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Further improvements in semiconductor processes require data collected from a variety of sensors throughout the fab to implement yield learning and predictive models.
