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For industrial and semiconductor applications
The role of gas purging in semiconductor manufacturing
Gas purging is the process of displacing unwanted gases or contaminants with an inert gas, typically nitrogen (N₂), to provide ultra-clean environments essential for semiconductor fabrication. Some key applications include:
Wafer storage purging
Ensuring that wafers remain uncontaminated by maintaining a controlled nitrogen environment in FOUPs (Front Opening Unified Pods) and storage chambers.
Atomic layer deposition (ALD)
Precisely controlling gas flows during deposition cycles to create uniform and defect-free thin films notably also used in battery manufacturing, where it plays a role in improving the performance and longevity of battery components.
Process chamber cleaning
Purging residual reactive gases from etching and deposition chambers to prevent cross-contamination and extend equipment longevity.
Why Sensirion should be part of your solution
Sensirion’s digital mass flow controllers offer high accuracy, fast response times, and multi-gas calibration, making them an optimal choice for semiconductor and industrial gas purging applications. Here’s why:
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5
SFC5500
Versatile mass flow controller, via online distribution
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SFC6000D-20slm
Best price-performance ratio, distribution version, 20 slm
- Sensor
- Mass flow controllers
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SFC6000D-50slm
Best price-performance ratio, distribution version, 50 slm
- Sensor
- Mass flow controllers
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SFC6000D-5slm
Best price-performance ratio, distribution version, 5 slm
- Sensor
- Mass flow controllers
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Download our onepager on gas purging for free.
