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Modern semiconductor processing techniques such as vacuum deposition and DRIE (deep reactive ion etching) require fast control of various gases.
For clean surface processing of wafers with DRIE (deep reactive ion etching), different process gases have to be changed at high speed. The fast response time of Sensirion mass flow controllers increases the quality of these processes.
When processing wafers with DRIE (deep reactive ion etching), different process gases have to be changed at high speed. The fast response time of our MFCs increases the speed of these processes.
Due to the high long-term stability, systems do not have to be stopped to recalibrate the mass flow controllers.
Leading suppliers in the field of semiconductor processing using DRIE have for years relied on Sensirion’s fast, highly accurate and reliable mass flow controllers.
Download our onepager on thin film deposition – stable and precise control of gases during deposition processes – for free.
Download our onepager on thin film deposition – stable and precise control of gases during deposition processes – for free.